Interflux® DP 5600 is a no-clean solder paste for low temperature SnBi(Ag) alloys.
RO L0 to EN and IPC standards
Sn42Bi57Ag1 (melting point 139°C ~ 282°F)
Interflux®LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free and SnPb(Ag) alloys.
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications
Interflux® DP 5505 is our all-round, high stability, no-clean solder paste in lead-free alloys. DP 5505 is also available in SnPb(Ag) alloys.
High printing speeds
Low Voiding
RO L0 to EN and IPC standards
Interflux® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.
Interflux® IF 9057 is a no-clean solder paste in lead-free and SnPb(Ag) alloys developed for clear residues after reflow. It works very well for Pin-in-Paste (PiP) applications and in vapor phase soldering.
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