µ-dIFe 7

Interflux^® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications‍

Key Advantages

Fast and easy application
Repeatable and selective paste volume
Reduced risk of bridging on μ-BGAs
Suitable for the ERSA Dip&Print Station
For Ball Grid Arrays, J-lead and Gull Wing ICs
Absolutely halogen free
Available in lead-free alloys
No-clean - no post cleaning needed
RoHS compliant