LMPA™-Q6

Interflux®LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%

  • Enhanced low melting point solder paste
  • High stability on the stencil
  • Absolutely halide-free
  • Smooth, clear and transparent residue
  • Low voiding
  • Reduced cost of production
  • Increased mechanical reliability
Key Advantages
  • Enhanced low melting point solder paste
  • Low soldering temperatures
  • Low voiding
  • Increased mechanical reliability
  • For Ball Grid Arrays, J-lead and Gull Wing ICs
  • Absolutely halogen free
  • Reduced cost of production
  • Lead-free
  • Rosin based (colophony
  • No-clean - no post cleaning needed
  • RoHS compliant