LMPA-Q7

Interflux LMPA-Q7 is a low melting point solder paste with optimised stencil performance and enhanced mechanical properties. LMPA-Q7 succeeds LMPA-Q6.LMPA-Q7 provides longer stencil life in combination with an optimised printability. The LMPA-Q alloy provides better mechanical properties than standard SnBi(Ag) alloys.

• Enhanced low melting point solder paste
• Low soldering temperatures
• High printing speeds
• Long stencil life, high stability
• Suitable for Pin-in-Paste (PIP)
• Reduced head-in-pillow defect
• Smooth transparent residue
• Environment friendly
• Lead-free
• Absolutely halogen free